MANUFACTURe
At Microtek, we pride ourselves on creating a world-class manufacturing operation that is customized to each of our clients’ unique needs.
Our manufacturing capabilities
Wire Bonding
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Ultra fine pitch wire bonding
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Au, Al and Cu wire bonding
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Ball and Wedge wire bonding
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Deep access wire bonding
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Gold Ribbon bonding
Die Attach
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Automatic die attach ±0.5 μm placement accuracy
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Automatic Eutectic die attach
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Epoxy, solder, eutectic and exotic material die attach
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Underfill and Globtop
Flip Chip and Bumping
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Wafer bumping up to 8″
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Singulated die bumping
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Thermosonic die attach
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Thermocompression die attach
Surface Mount Components
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Solder and screen stations
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IR convection reflow
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Wave solder reflow
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Automatic adhesive & solder paste dispense
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Fine pitch BGA attach
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Fine pitch solderball placement
Operations
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Access to domestic and international manufacturing
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High mix, low volume and high volume manufacturing capabilities
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Batch or continuous manufacturing capabilities
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Manufacturing process validation
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Materials management and handling
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Vendor audits and certification
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Experienced technicians and assembly staff
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Supply chain management